Variable latch

ABSTRACT

Numerous embodiments of variable latch and a method of formation are disclosed. One or more embodiments of the claimed subject matter may comprise a latch with a plurality of contact points formed thereon, and method of fabrication. The plurality of contact points may allow adequate socketing of microelectronic packages of varying sizes in a socket assembly, without the need to modify the latch when the microelectronic package size varies.

RELATED APPLICATION(S)

This application is a Divisional of U.S. application Ser. No. 10/391,893filed Mar. 18, 2003, which is incorporated herein by reference.

BACKGROUND

As part of the design and development of microelectronic devices, ascreening and testing operation may be performed in order to detect andremove defective microelectronic devices. In one particular operation, aburn-in stress test may be performed, where devices may be operated inelevated voltage and/or temperature states. Operations such as this maybe performed on several devices in parallel, and all or part of theoperation may be automated, such as the socket insertion and removalprocess for a particular device. When a device is inserted in a socket,one or more latches, or packet retaining devices, may automaticallylatch on the device, and hold the device with sufficient force to ensurecontact with the socket. When the operation is complete, the latch maybe configured to release the device so that it may be removed by one ormore additional automated mechanisms such as a pick and place mechanism.This particular type of socket that allows for automated insertionand/or removal of a package may be referred to in some contexts as aself-captivating socket.

FIG. 3 illustrates an assembly 200 comprising a microelectronic device,illustrated as microelectronic package 218. Package 218 is shown incontact with a socket 220, which may be part of a testing environmentsuch as a burn in environment. As shown in FIG. 3, when latch 202 isengaged, or latched, to the device 218, the latch contact point 206 maycontact the package. A spring such as spring 222 may cause latch 202 toexert a substantially vertical force on the package 218, which may bereferred to as socketing force. Adequate socketing force may result inelectrical contact being made between device 218 and socket 220. Latch202 may comprise a lever arm 204, a contact point 206 located on thelever arm, and a fixed pivot point 214, which may also be referred to asa fulcrum. Pivot point 214 may be configured such that latch 202 iscapable of rotating about an axis at least partially defined by thepivot point. A notched tab 212 may be located opposite pivot point 214from the lever arm 204. Notched tab may have an actuating arm 210attached, and a cover 208 attached to the actuating arm 210. Cover 208,which may also be referred to as an open top lid, may be coupled to oneor more springs 222 that exert force on the cover.

In operation, a package may be inserted into socket 220 in the followingmanner: Cover 208 may be forced downwards by an insertion tool (notshown), which, due to the configuration of the actuating arm and thenotched tab, will cause latch 202 to rotate about the axis defined bypivot point 214. A package, such as package 218, may be inserted intosocket 220. Force may be removed from cover 208, and this will result inlatch 202 rotating to make contact with and apply force to package 218on contact point 206, due at least in part to the force exerted by oneor more springs 222 on cover 208. The force applied by latch 202 may bea substantially vertical force, and may provide electrical contactbetween package 218 and socket 220. However, depending on the dimensionsof the microelectronic package 218, latch 202 may not provide adequateforce to ensure contact between the socket and the package.Additionally, while sockets used in a testing environment may beconfigured to receive packages of varying sizes, a latch such as latch202 may not be sufficient for use in testing devices of varying sizes,and when testing devices of varying sizes, latches may have to bechanged between tests.

Therefore, it would be advantageous to develop a latch that may be usedin environments such as testing environment, that are capable ofproviding adequate socketing force and sufficient contact points forsocketing of packages with varying sizes, thereby reducing oreliminating the need to alter or modify a latch when the package sizevaries.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter regarded as embodiments of the claimed subject matteris particularly pointed out and distinctly claimed in the concludingportion of the specification. Embodiments of the claimed subject matter,however, both as to organization and method of operation, together withobjects, features, and advantages thereof, may best be understood byreference to the following detailed description when read with theaccompanying drawings in which:

FIG. 1 is an oblique view of a first embodiment of a latch andmicroelectronic package, according to the present invention;

FIG. 2 is a side cross-sectional view of a first embodiment of a latchand socketing assembly, according to the present invention; and

FIG. 3 is a side cross-sectional view of a latch and socketing assembly,as known in the art.

DETAILED DESCRIPTION

Embodiments of the claimed subject matter may comprise a variable latchand a method of fabrication. One particular embodiment of the claimedsubject matter may comprise a latch with a plurality of contact pointsformed thereon. The plurality of contact points may allow adequatesocketing of microelectronic packages of varying sizes in a socketassembly, without the need to modify the latch.

It is worthy to note that any reference in the specification to “oneembodiment” or “an embodiment” means that a particular feature,structure, or characteristic described in connection with the embodimentis included in at least one embodiment of the claimed subject matter.The appearances of the phrase “in one embodiment” in various places inthe specification are not necessarily all referring to the sameembodiment.

Numerous specific details may be set forth herein to provide a thoroughunderstanding of the embodiments of the claimed subject matter. It willbe understood by those skilled in the art, however, that the embodimentsof the claimed subject matter may be practiced without these specificdetails. In other instances, well-known methods, procedures andcomponents have not been described in detail so as not to obscure theembodiments of the claimed subject matter. It can be appreciated thatthe specific structural and functional details disclosed herein may berepresentative and do not necessarily limit the scope of the claimedsubject matter.

Referring now in detail to the drawings wherein like parts aredesignated by like reference numerals throughout, there is illustratedin FIG. 1 an oblique view of a first embodiment of a latch in accordancewith one embodiment of the claimed subject matter. Illustrated in FIG. 1is a latch 100. Latch 100 may be comprised of a latch arm 108, a notchedtab 112, pivot point 110, and contact points 106 and 104, but it isimportant to note that latch 100 is not limited to just this particularconfiguration, but may comprise any latch with a plurality of contactpoints, for example. The latch shown in FIG. 1 may be formed of aplastic or vinyl composition, or may be formed from a heat resistantcomposition including carbon based glass-filled plastics such as PES(Polyethylene Styrene) or PEI (Polyetherimide) for example, but theclaimed subject matter is not so limited. A latch such as latch 100 maybe formed from one or more injection molding processes, or one or moremachining processes, but it is important to note that the claimedsubject matter is not limited in this respect, and any fabricationprocess that results in the fabrication of a latch with a plurality ofcontact points is in accordance with the claimed subject matter.Additionally, dimensions of the latch may depend on the particularapplication the latch will be utilized in, such as part of a burn insocket assembly for flash memory devices, but it is envisioned that onepossible embodiment would utilize a latch approximately 10 millimetersin length.

Shown in FIGS. 2 a and 2 b are two possible applications of a latch asillustrated in FIG. 1. Shown in FIGS. 2 a and 2 b are two latchesutilized in socketing assemblies, which may be part of a testingenvironment such as a burn in environment, for example. In oneembodiment, the socket assemblies illustrated may be referred to asself-captivating sockets, but those of skill in the art will understandthat the claimed subject matter is not limited to any particular type orcategory of socket or socketing assembly, but any type of device that isconfigured to provide a contact interface between two or more electronicdevices is in accordance with at least one embodiment of a socket orsocketing assembly. FIG. 2 a illustrates a latch 100 comprising part ofassembly 101, but in alternative configurations, multiple latches may beused in a socketing assembly, and the depiction of a single latch isshown here for the purpose of illustration. Latch 100 comprises a latcharm 108, a notched tab 112, pivot point 110, and contact points 106 and104. In this particular configuration, latch contact point 106 in shownas being in contact with package 118. In this configuration, latch 100may be providing socketing force, which may comprise a substantiallyvertical force, for package 118. Force may be provided by use of one ormore springs (not shown), which may be coupled to the latch, and mayprovide a substantially vertical downward force on the latch resultingin socketing force being applied to package 118. In a socketing assemblysuch as assembly 101, the amount of mechanical force applied by thelatch to the package may depend on the contact point in contact with adevice, since this will result in a particular moment arm length.Additionally, latch timing may be affected by the contact point incontact with a device. Latch timing, in this embodiment, is the timeduration required for a latch to remove force from a device relative tothe motion of one or more other components of a socketing assembly suchas a cover (not shown).

Typically, socketing force applied by a latch may vary depending on theparticular device and/or socket configuration, but the claimed subjectmatter is not limited in this respect. In this embodiment, theapplication of socketing force by latch 100 on device 118 may result inelectrical continuity being provided between package 118 and socket 120.Illustrated in this embodiment is a microelectronic package 118, whichmay comprise, for example, a microprocessor package, but it is importantto note that package 118 is not so limited. Package 118 may comprise anysort of microelectronic device including an ASIC, flash memory, or anychip scale package such as a folded stack chip scale package, forexample.

A notched tab 112 may be formed on the body of latch 100, and may beformed opposite the pivot point from lever arm 108. This particularconfiguration may allow rotation of the latch 100 about pivot point 110when force is applied to notched tab 112. An actuating arm (not shown)may be coupled to notched tab 112, and the actuating arm may be coupledto a lid (not shown) when installed in a testing apparatus. However, theclaimed subject matter is not limited to use of a notched tab, or use ofan opposing lever configuration to allow rotation about pivot point 110.For example, force could be applied upwards on lever arm 108 to removethe latch from contact with a package, and in this configuration nonotched tab may be required. Additionally, force may be applied to thelatch in the vicinity of top surface 114 in order to provide thenecessary force to rotate the latch about pivot point 110, although,again, the claimed subject matter is not so limited.

FIG. 2 b illustrates a second socketing assembly that may incorporate alatch such as latch 100. As shown in FIG. 2 b, latch 100 is beingutilized in a socketing assembly where a larger package than thatillustrated in FIG. 2 a is being socketed. In this embodiment, latch 100comprises a latch arm 108, a notched tab 112, pivot point 110, andcontact points 106 and 104. In this particular configuration, latch 100is shown as having the contact point 106 in contact with a package 124.In this configuration, latch 100 may be providing socketing force forpackage 124 by use of one or more springs (not shown). This may resultin electrical continuity being provided between package 124 and socket120. Illustrated in this embodiment is a microelectronic package 124,which may comprise, for example, a microprocessor package, but, again,it is important to note that package 124, similarly to package 118, isnot so limited, and may include, for example, any chip scale packagesuch as a folded stack chip scale package.

Shown in FIGS. 2 a and 2 b are two uses of latch 100 in socketingassemblies. These configurations demonstrate that a latch such as latch100 may be used to socket microelectronic devices of a variety of sizes.It is important to note, however, that while latch 100 is shown ashaving two contact points 104 and 106, the claimed subject matter is notso limited, but may comprise a latch with multiple contact points. Thoseof skill in the art will appreciate that the amount of contact pointsand configuration of a latch such as latch 100 may depend at least inpart on the chosen application. For example, a latch with three contactpoints may be capable of latching devices of a greater variety than alatch with two contact points. Additionally, differing devices mayrequire differing socketing forces, depending on the configuration ofthe device. Differing configurations of a latch such as latch 100 may bedetermined based at least in part on the socketing force required bydevices that will be socketed by a latch in accordance with one or moreembodiments disclosed herein.

It can be appreciated that the embodiments may be applicable to latchesor anywhere a variable latch may be desirable. Certain features of theembodiments of the claimed subject matter have been illustrated asdescribed herein, however, many modifications, substitutions, changesand equivalents will now occur to those skilled in the art.Additionally, while several functional blocks and relations between themhave been described in detail, it is contemplated by those of skill inthe art that several of the operations may be performed without the useof the others, or additional functions or relationships betweenfunctions may be established and still be in accordance with the claimedsubject matter. It is, therefore, to be understood that the appendedclaims are intended to cover all such modifications and changes as fallwithin the true spirit of the embodiments of the claimed subject matter.

1. A socketing assembly, comprising: at least one latch, wherein said atleast one latch has a plurality of contact points formed thereon; and asocket coupled to the at least one latch, wherein said socket isconfigured to, in operation, receive one or more sizes ofmicroelectronic package.
 2. The socketing assembly of claim 1, whereinat least one of said at least one latch has two contact points formedthereon.
 3. The socketing assembly of claim 1, wherein at least one ofsaid at least one latch is formed from glass-filled plastic.
 4. Thesocketing assembly of claim 1, wherein the socket comprises a universalsocket.
 5. The socketing assembly of claim 1, wherein the socketcomprises a self-captivating socket.
 6. The socketing assembly of claim1, further comprising two latches, wherein said two latches each havetwo contact points formed thereon.
 7. The socketing assembly of claim 1,further including one or more springs coupled to said at least onelatch, an actuating arm coupled to said at least one latch, and a lidcoupled to said actuating arm.
 8. The socketing assembly of claim 1,wherein said socket comprises a burn-in socket.
 9. A method of forming alatch, comprising: forming a body; forming a tab on the body; forming alever arm on the body, wherein the lever arm is formed substantiallyopposite said tab; forming a fixed pivot point on the body; and forminga plurality of contact points on the lever arm, wherein at least one ofsaid plurality of contact points is configured to contact one or moremicroelectronic devices.
 10. The method of claim 9, wherein forming ofthe latch comprises one or more injection molding processes.
 11. Themethod of claim 9, said method further comprising substantially formingsaid latch from glass-filled plastic.
 12. The method of claim 9, saidmethod further comprising forming said latch to provide socketing forceto a microelectronic package.
 13. The method of claim 9, said methodfurther comprising forming said latch to have two contact points. 14.The method of claim 9, said method further comprising forming saidcontact points to socket microelectronic devices of different physicaldimensions.
 15. The method of claim 9, said method further comprisingforming said latch to further include one or more springs coupled tosaid at least one latch, a actuating arm coupled to at least one latch,and a lid coupled to said actuating arm.
 16. The method of claim 9, saidmethod further comprising forming said latch comprise one component of aburn-in socket.
 17. The socketing assembly of claim 1, wherein saidlatch is formed from one or more of plastic, vinyl, polyethylenestyrene, and polyetherimide.
 18. The socketing assembly of claim 1,wherein said latch is approximately 10 millimeters in length.
 19. Thesocketing assembly of claim 1, wherein said latch is coupled to receivea first force and to apply a substantially vertical second force to amicroelectronic package to hold the microelectronic package on thesocket with electrical continuity between the microelectronic packageand the socket.
 20. A socketing assembly, comprising: a latch arm havinga plurality of contact points formed thereon; and a socket coupled tothe latch arm, wherein said socket is configured to, in operation,receive one or more sizes of microelectronic package.
 21. The socketingassembly of claim 20, wherein of said latch arm has two contact pointsformed thereon.
 22. The socketing assembly of claim 20, wherein of saidlatch arm is formed from glass-filled plastic.
 23. The socketingassembly of claim 20, wherein the socket comprises a universal socket.24. The socketing assembly of claim 20, wherein the socket comprises aself-captivating socket.
 25. The socketing assembly of claim 20, furthercomprising two latch arms, wherein each of said two latch arms has twocontact points formed thereon.
 26. The socketing assembly of claim 20,further comprising one or more springs coupled to said latch arm, anactuating arm coupled to said latch arm, and a lid coupled to saidactuating arm.
 27. The socketing assembly of claim 20, wherein saidsocket comprises a burn-in socket.
 28. The socketing assembly of claim20, wherein said latch arm is formed from one or more of plastic, vinyl,polyethylene styrene, and polyetherimide.
 29. The socketing assembly ofclaim 20, wherein said latch arm is approximately 10 millimeters inlength.
 30. The socketing assembly of claim 20, wherein said latch armis coupled to receive a first force and to apply a substantiallyvertical second force to a microelectronic package to hold themicroelectronic package on the socket with electrical continuity betweenthe microelectronic package and the socket.